MC100ES8011PEF
vs
TS88915TMWB/T70
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
THOMSON-CSF SEMICONDUCTORS
|
| Part Package Code |
SOIC
|
|
| Package Description |
LEAD FREE, MS-012AA, SOIC-8
|
,
|
| Pin Count |
8
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
100E
|
|
| Input Conditioning |
DIFFERENTIAL
|
MUX
|
| JESD-30 Code |
R-PDSO-G8
|
S-CQCC-J28
|
| JESD-609 Code |
e3
|
|
| Length |
4.9 mm
|
|
| Logic IC Type |
LOW SKEW CLOCK DRIVER
|
PLL BASED CLOCK DRIVER
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Inverted Outputs |
|
1
|
| Number of Terminals |
8
|
28
|
| Number of True Outputs |
2
|
7
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
SOP
|
QCCJ
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE
|
CHIP CARRIER
|
| Propagation Delay (tpd) |
0.94 ns
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Same Edge Skew-Max (tskwd) |
0.02 ns
|
0.75 ns
|
| Seated Height-Max |
1.75 mm
|
|
| Supply Voltage-Max (Vsup) |
3.465 V
|
5.25 V
|
| Supply Voltage-Min (Vsup) |
3.135 V
|
4.75 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
ECL
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
GULL WING
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
DUAL
|
QUAD
|
| Width |
3.9 mm
|
|
| Base Number Matches |
2
|
4
|
| fmax-Min |
|
70 MHz
|
|
|
|
Compare MC100ES8011PEF with alternatives
Compare TS88915TMWB/T70 with alternatives