MC100H602FNG
vs
SY100H602JZ
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ON SEMICONDUCTOR
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
QLCC
|
|
Package Description |
LEAD FREE, PLASTIC, LCC-28
|
LCC-28
|
Pin Count |
28
|
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8541.50.00.40
|
Delay-Max |
3.2 ns
|
|
Interface IC Type |
TTL TO ECL TRANSLATOR
|
TTL TO ECL TRANSLATOR
|
JESD-30 Code |
S-PQCC-J28
|
S-PQCC-J28
|
JESD-609 Code |
e3
|
e3
|
Length |
11.505 mm
|
11.48 mm
|
Moisture Sensitivity Level |
1
|
2
|
Number of Bits |
1
|
1
|
Number of Functions |
1
|
9
|
Number of Terminals |
28
|
28
|
Operating Temperature-Max |
75 °C
|
85 °C
|
Operating Temperature-Min |
|
|
Output Latch or Register |
NONE
|
LATCH
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QCCJ
|
QCCJ
|
Package Equivalence Code |
LDCC28,.5SQ
|
LDCC28,.5SQ
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.57 mm
|
4.57 mm
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
4.5 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
ECL100K
|
|
Temperature Grade |
COMMERCIAL EXTENDED
|
COMMERCIAL EXTENDED
|
Terminal Finish |
Tin (Sn)
|
MATTE TIN
|
Terminal Form |
J BEND
|
J BEND
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Width |
11.505 mm
|
11.48 mm
|
Base Number Matches |
1
|
2
|
|
|
|
Compare MC100H602FNG with alternatives
Compare SY100H602JZ with alternatives