MC100LVEL11DTR2
vs
100LVEL11M
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
SOIC
|
SOIC
|
| Package Description |
PLASTIC, TSSOP-8
|
0.150 INCH, MS-012, SOIC-8
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
unknown
|
unknown
|
| Additional Feature |
NECL MODE: 0V VCC WITH VEE = -3V TO -3.8V
|
NECL MODE:VCC=0V WITH VEE=-3V TO -3.8V
|
| Family |
100LVEL
|
100LVEL
|
| Input Conditioning |
DIFFERENTIAL
|
DIFFERENTIAL
|
| JESD-30 Code |
S-PDSO-G8
|
R-PDSO-G8
|
| JESD-609 Code |
e0
|
e3
|
| Length |
3 mm
|
4.9 mm
|
| Logic IC Type |
LOW SKEW CLOCK DRIVER
|
LOW SKEW CLOCK DRIVER
|
| Moisture Sensitivity Level |
NOT SPECIFIED
|
1
|
| Number of Functions |
1
|
1
|
| Number of Inverted Outputs |
|
|
| Number of Terminals |
8
|
8
|
| Number of True Outputs |
2
|
2
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
SOP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
240
|
260
|
| Propagation Delay (tpd) |
0.405 ns
|
0.405 ns
|
| Qualification Status |
COMMERCIAL
|
COMMERCIAL
|
| Same Edge Skew-Max (tskwd) |
0.02 ns
|
0.02 ns
|
| Seated Height-Max |
1.1 mm
|
1.75 mm
|
| Supply Voltage-Max (Vsup) |
3.8 V
|
3.8 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
ECL
|
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
| Width |
3 mm
|
3.9 mm
|
| fmax-Min |
1000 MHz
|
1000 MHz
|
| Base Number Matches |
2
|
2
|
|
|
|