MC10115LD
vs
MC10115FNR2
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA INC
|
ONSEMI
|
| Package Description |
DIP, DIP16,.3
|
PLASTIC, LCC-20
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
R-XDIP-T16
|
S-PQCC-J20
|
| JESD-609 Code |
e0
|
e0
|
| Number of Terminals |
16
|
20
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-30 °C
|
-30 °C
|
| Package Body Material |
CERAMIC
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
QCCJ
|
| Package Equivalence Code |
DIP16,.3
|
LDCC20,.4SQ
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
IN-LINE
|
CHIP CARRIER
|
| Supply Current-Max |
29 mA
|
29 mA
|
| Surface Mount |
NO
|
YES
|
| Technology |
ECL10K
|
ECL
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
J BEND
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Base Number Matches |
2
|
1
|
| Part Package Code |
|
QLCC
|
| Pin Count |
|
20
|
| Factory Lead Time |
|
4 Weeks
|
| Differential Output |
|
NO
|
| Input Characteristics |
|
DIFFERENTIAL
|
| Interface IC Type |
|
LINE RECEIVER
|
| Interface Standard |
|
GENERAL PURPOSE
|
| Length |
|
8.965 mm
|
| Moisture Sensitivity Level |
|
1
|
| Number of Functions |
|
4
|
| Peak Reflow Temperature (Cel) |
|
235
|
| Qualification Status |
|
Not Qualified
|
| Receive Delay-Max |
|
2.9 ns
|
| Receiver Number of Bits |
|
4
|
| Seated Height-Max |
|
4.57 mm
|
| Width |
|
8.965 mm
|
|
|
|
Compare MC10115LD with alternatives
Compare MC10115FNR2 with alternatives