MC10131FN
vs
MC10H131FNR2
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA INC
|
ON SEMICONDUCTOR
|
| Part Package Code |
QLCC
|
QLCC
|
| Package Description |
QCCJ, LDCC20,.4SQ
|
PLASTIC, LCC-20
|
| Pin Count |
20
|
20
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
WITH ADDITIONAL COMMON CLOCK
|
|
| Family |
10K
|
10H
|
| JESD-30 Code |
S-PQCC-J20
|
S-PQCC-J20
|
| JESD-609 Code |
e0
|
e0
|
| Length |
8.9662 mm
|
8.965 mm
|
| Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
| Max Frequency@Nom-Sup |
125000000 Hz
|
250000000 Hz
|
| Number of Bits |
1
|
2
|
| Number of Functions |
2
|
1
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
85 °C
|
75 °C
|
| Operating Temperature-Min |
-30 °C
|
|
| Output Characteristics |
OPEN-EMITTER
|
OPEN-EMITTER
|
| Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
QCCJ
|
| Package Equivalence Code |
LDCC20,.4SQ
|
LDCC20,.4SQ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Power Supply Current-Max (ICC) |
62 mA
|
62 mA
|
| Propagation Delay (tpd) |
5 ns
|
1.7 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.57 mm
|
4.57 mm
|
| Surface Mount |
YES
|
YES
|
| Technology |
ECL
|
ECL
|
| Temperature Grade |
OTHER
|
COMMERCIAL EXTENDED
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Terminal Form |
J BEND
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
| Width |
8.9662 mm
|
8.965 mm
|
| fmax-Min |
125 MHz
|
250 MHz
|
| Base Number Matches |
2
|
2
|
| Rohs Code |
|
No
|
| Moisture Sensitivity Level |
|
1
|
| Packing Method |
|
TR
|
| Peak Reflow Temperature (Cel) |
|
235
|
|
|
|
Compare MC10131FN with alternatives
Compare MC10H131FNR2 with alternatives