MC10176FN
vs
M38510/06102BFA
feature comparison
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
MOTOROLA INC
|
QP SEMICONDUCTOR INC
|
Part Package Code |
QLCC
|
DFP
|
Package Description |
QCCJ, LDCC20,.4SQ
|
DFP,
|
Pin Count |
20
|
16
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
10K
|
10K
|
JESD-30 Code |
S-PQCC-J20
|
R-GDFP-F16
|
JESD-609 Code |
e0
|
e0
|
Length |
8.965 mm
|
|
Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
Number of Bits |
6
|
1
|
Number of Functions |
1
|
2
|
Number of Terminals |
20
|
16
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-30 °C
|
-55 °C
|
Output Characteristics |
OPEN-EMITTER
|
|
Output Polarity |
TRUE
|
COMPLEMENTARY
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
Package Code |
QCCJ
|
DFP
|
Package Equivalence Code |
LDCC20,.4SQ
|
FL16,.3
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
CHIP CARRIER
|
FLATPACK
|
Power Supply Current-Max (ICC) |
121 mA
|
|
Propagation Delay (tpd) |
5 ns
|
3.9 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.57 mm
|
|
Surface Mount |
YES
|
YES
|
Technology |
ECL
|
ECL
|
Temperature Grade |
OTHER
|
MILITARY
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
Terminal Form |
J BEND
|
FLAT
|
Terminal Pitch |
1.27 mm
|
|
Terminal Position |
QUAD
|
DUAL
|
Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
Width |
8.965 mm
|
|
fmax-Min |
125 MHz
|
200 MHz
|
Base Number Matches |
2
|
1
|
Screening Level |
|
MIL-PRF-38535 Class B
|
|
|
|
Compare MC10176FN with alternatives
Compare M38510/06102BFA with alternatives