MC10E101FNG
vs
MC10E101FNR2G
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ON SEMICONDUCTOR
|
ON SEMICONDUCTOR
|
| Part Package Code |
QLCC
|
QLCC
|
| Package Description |
LEAD FREE, PLASTIC, LCC-28
|
QCCJ, LDCC28,.5SQ
|
| Pin Count |
28
|
28
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V
|
NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V
|
| Family |
10E
|
10E
|
| JESD-30 Code |
S-PQCC-J28
|
S-PQCC-J28
|
| JESD-609 Code |
e3
|
e3
|
| Length |
11.505 mm
|
11.505 mm
|
| Logic IC Type |
OR/NOR GATE
|
OR/NOR GATE
|
| Number of Functions |
4
|
4
|
| Number of Inputs |
4
|
4
|
| Number of Terminals |
28
|
28
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
|
|
| Output Characteristics |
OPEN-EMITTER
|
OPEN-EMITTER
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
QCCJ
|
| Package Equivalence Code |
LDCC28,.5SQ
|
LDCC28,.5SQ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Power Supply Current-Max (ICC) |
36 mA
|
36 mA
|
| Prop. Delay@Nom-Sup |
0.5 ns
|
0.5 ns
|
| Propagation Delay (tpd) |
0.6 ns
|
0.6 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Schmitt Trigger |
NO
|
NO
|
| Seated Height-Max |
4.57 mm
|
4.57 mm
|
| Supply Voltage-Max (Vsup) |
5.7 V
|
5.7 V
|
| Supply Voltage-Min (Vsup) |
4.2 V
|
4.2 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
ECL
|
ECL
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
TIN
|
TIN
|
| Terminal Form |
J BEND
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
11.505 mm
|
11.505 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Manufacturer Package Code |
|
776-02
|
| Factory Lead Time |
|
4 Weeks
|
| Moisture Sensitivity Level |
|
3
|
| Packing Method |
|
TR
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare MC10E101FNG with alternatives
Compare MC10E101FNR2G with alternatives