MC10E155FN
vs
SY10EP53VKI
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
MICREL INC
|
| Package Description |
QCCJ, LDCC28,.5SQ
|
TSSOP, TSSOP10,.19,20
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| JESD-30 Code |
S-PQCC-J28
|
S-PDSO-G10
|
| JESD-609 Code |
e0
|
e0
|
| Logic IC Type |
MULTIPLEXER
|
D FLIP-FLOP
|
| Number of Functions |
6
|
1
|
| Number of Inputs |
2
|
|
| Number of Terminals |
28
|
10
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
TSSOP
|
| Package Equivalence Code |
LDCC28,.5SQ
|
TSSOP10,.19,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Power Supplies |
-5.2 V
|
|
| Power Supply Current-Max (ICC) |
102 mA
|
47 mA
|
| Prop. Delay@Nom-Sup |
0.7 ns
|
0.4 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
YES
|
YES
|
| Technology |
ECL10K
|
ECL
|
| Temperature Grade |
OTHER
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn85Pb15)
|
| Terminal Form |
J BEND
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Base Number Matches |
4
|
2
|
| Part Package Code |
|
MSOP
|
| Pin Count |
|
10
|
| HTS Code |
|
8542.39.00.01
|
| Additional Feature |
|
NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V
|
| Family |
|
10E
|
| Length |
|
3 mm
|
| Max Frequency@Nom-Sup |
|
3000000000 Hz
|
| Moisture Sensitivity Level |
|
1
|
| Number of Bits |
|
1
|
| Output Polarity |
|
COMPLEMENTARY
|
| Peak Reflow Temperature (Cel) |
|
240
|
| Propagation Delay (tpd) |
|
0.35 ns
|
| Seated Height-Max |
|
1.1 mm
|
| Supply Voltage-Max (Vsup) |
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
|
3 V
|
| Supply Voltage-Nom (Vsup) |
|
3.3 V
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Trigger Type |
|
POSITIVE EDGE
|
| Width |
|
3 mm
|
|
|
|
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