MC10E451FNG
vs
SY100E451JCTR
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
ONSEMI
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
QLCC
|
|
Package Description |
LEAD FREE, PLASTIC, LCC-28
|
LCC-28
|
Pin Count |
28
|
|
Manufacturer Package Code |
776-02
|
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
4 Weeks
|
|
Additional Feature |
NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V
|
WITH DIFFERENTIAL CLOCK
|
Family |
10E
|
100E
|
JESD-30 Code |
S-PQCC-J28
|
S-PQCC-J28
|
JESD-609 Code |
e3
|
|
Length |
11.505 mm
|
11.48 mm
|
Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
Max Frequency@Nom-Sup |
1100000000 Hz
|
|
Moisture Sensitivity Level |
3
|
|
Number of Bits |
6
|
6
|
Number of Functions |
1
|
1
|
Number of Terminals |
28
|
28
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
|
|
Output Characteristics |
OPEN-EMITTER
|
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QCCJ
|
QCCJ
|
Package Equivalence Code |
LDCC28,.5SQ
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
Peak Reflow Temperature (Cel) |
260
|
|
Power Supply Current-Max (ICC) |
101 mA
|
|
Propagation Delay (tpd) |
1.05 ns
|
0.8 ns
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
4.57 mm
|
4.57 mm
|
Supply Voltage-Max (Vsup) |
5.7 V
|
|
Supply Voltage-Min (Vsup) |
4.2 V
|
|
Supply Voltage-Nom (Vsup) |
5 V
|
|
Surface Mount |
YES
|
YES
|
Technology |
ECL
|
ECL
|
Temperature Grade |
OTHER
|
|
Terminal Finish |
TIN
|
|
Terminal Form |
J BEND
|
J BEND
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
Width |
11.505 mm
|
11.48 mm
|
fmax-Min |
1100 MHz
|
1100 MHz
|
Base Number Matches |
2
|
3
|
Packing Method |
|
TR
|
|
|
|
Compare MC10E451FNG with alternatives
Compare SY100E451JCTR with alternatives