MC10E457FNG
vs
PI3DBV40AE
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ONSEMI
|
DIODES INC
|
Part Package Code |
QLCC
|
|
Package Description |
LEAD FREE, PLASTIC, LCC-28
|
TSSOP,
|
Pin Count |
28
|
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
4 Weeks
|
|
Additional Feature |
NECL MODE OPERATING RANGE: VEE = -4.2 V TO -5.7 V WITH VCC = 0 V
|
|
Family |
10E
|
|
JESD-30 Code |
S-PQCC-J28
|
R-PDSO-G48
|
JESD-609 Code |
e3
|
e3
|
Length |
11.505 mm
|
12.5 mm
|
Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER AND DEMUX/DECODER
|
Number of Functions |
3
|
4
|
Number of Inputs |
2
|
2
|
Number of Outputs |
1
|
4
|
Number of Terminals |
28
|
48
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Output Characteristics |
OPEN-EMITTER
|
3-STATE
|
Output Polarity |
COMPLEMENTARY
|
TRUE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QCCJ
|
TSSOP
|
Package Equivalence Code |
LDCC28,.5SQ
|
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
CHIP CARRIER
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
|
Power Supply Current-Max (ICC) |
110 mA
|
|
Prop. Delay@Nom-Sup |
0.7 ns
|
|
Propagation Delay (tpd) |
0.7 ns
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.57 mm
|
1.2 mm
|
Supply Voltage-Max (Vsup) |
5.7 V
|
3.63 V
|
Supply Voltage-Min (Vsup) |
4.2 V
|
2.97 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
ECL
|
CMOS
|
Temperature Grade |
OTHER
|
INDUSTRIAL
|
Terminal Finish |
TIN
|
MATTE TIN
|
Terminal Form |
J BEND
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
DUAL
|
Width |
11.505 mm
|
6.1 mm
|
Base Number Matches |
1
|
1
|
ECCN Code |
|
EAR99
|
Moisture Sensitivity Level |
|
1
|
|
|
|
Compare MC10E457FNG with alternatives
Compare PI3DBV40AE with alternatives