MC10EL32DTR2G
vs
SY10EP32VKG-TR
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ON SEMICONDUCTOR
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
SOIC
|
|
| Package Description |
TSSOP, TSSOP8,.19
|
LEAD FREE, MSOP-8
|
| Pin Count |
8
|
|
| Manufacturer Package Code |
948R-02
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Additional Feature |
NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V
|
ALSO OPERATES AT 5V SUPPLY; PECL MODE: VEE =0V WITH VCC =3.3V TO 5V
|
| Family |
10EL
|
10EP
|
| JESD-30 Code |
S-PDSO-G8
|
S-PDSO-G8
|
| JESD-609 Code |
e3
|
e4
|
| Length |
3 mm
|
3 mm
|
| Logic IC Type |
PRESCALER
|
PRESCALER
|
| Max Frequency@Nom-Sup |
2600000000 Hz
|
|
| Moisture Sensitivity Level |
3
|
1
|
| Number of Data/Clock Inputs |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
TSSOP
|
| Package Equivalence Code |
TSSOP8,.19
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Power Supply Current-Max (ICC) |
30 mA
|
|
| Propagation Delay (tpd) |
0.6 ns
|
0.43 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.1 mm
|
1.1 mm
|
| Supply Voltage-Max (Vsup) |
5.7 V
|
3.63 V
|
| Supply Voltage-Min (Vsup) |
4.2 V
|
2.97 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
ECL
|
ECL
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
40
|
| Width |
3 mm
|
3 mm
|
| fmax-Min |
2600 MHz
|
4000 MHz
|
| Base Number Matches |
2
|
1
|
| Packing Method |
|
TR
|
|
|
|
Compare MC10EL32DTR2G with alternatives
Compare SY10EP32VKG-TR with alternatives