MC10EL35MNR4
vs
SY100EL51ZCTR
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ON SEMICONDUCTOR
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
DFN
|
SOIC
|
| Package Description |
DFN-8
|
SOIC-8
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V
|
WITH DIFFERENTIAL CLOCK
|
| Family |
10EL
|
100EL
|
| JESD-30 Code |
S-XDSO-N8
|
R-PDSO-G8
|
| JESD-609 Code |
e0
|
|
| Length |
2 mm
|
4.93 mm
|
| Logic IC Type |
J-K FLIP-FLOP
|
D FLIP-FLOP
|
| Max Frequency@Nom-Sup |
1400000000 Hz
|
|
| Number of Bits |
2
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
HVSON
|
SOP
|
| Package Equivalence Code |
SOLCC8,.08,20
|
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE
|
| Packing Method |
TR
|
TR
|
| Power Supply Current-Max (ICC) |
32 mA
|
|
| Prop. Delay@Nom-Sup |
0.745 ns
|
|
| Propagation Delay (tpd) |
0.7 ns
|
0.565 ns
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1 mm
|
1.73 mm
|
| Supply Voltage-Max (Vsup) |
5.7 V
|
|
| Supply Voltage-Min (Vsup) |
4.2 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
ECL
|
ECL
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
| Width |
2 mm
|
3.94 mm
|
| fmax-Min |
1800 MHz
|
2200 MHz
|
| Base Number Matches |
1
|
3
|
|
|
|
Compare MC10EL35MNR4 with alternatives
Compare SY100EL51ZCTR with alternatives