MC10EL58D
vs
SY10EL58ZITR
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Not Recommended
|
| Ihs Manufacturer |
ONSEMI
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
SOIC
|
SOIC
|
| Package Description |
SOIC-8
|
SOIC-8
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Additional Feature |
NECL MODE OPERATING RANGE: VEE = -4.2 V TO -5.7 V WITH VCC = 0 V
|
|
| Family |
10EL
|
10EL
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G8
|
| JESD-609 Code |
e0
|
|
| Length |
4.9 mm
|
4.93 mm
|
| Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Inputs |
2
|
2
|
| Number of Outputs |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Output Characteristics |
OPEN-EMITTER
|
|
| Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Equivalence Code |
SOP8,.25
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Packing Method |
RAIL
|
TR
|
| Peak Reflow Temperature (Cel) |
235
|
|
| Power Supply Current-Max (ICC) |
17 mA
|
|
| Prop. Delay@Nom-Sup |
0.38 ns
|
|
| Propagation Delay (tpd) |
0.34 ns
|
0.37 ns
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.75 mm
|
1.73 mm
|
| Supply Voltage-Max (Vsup) |
5.7 V
|
-5.5 V
|
| Supply Voltage-Min (Vsup) |
4.2 V
|
-4.75 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
-5.2 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
ECL
|
ECL
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
3.9 mm
|
3.94 mm
|
| Base Number Matches |
8
|
1
|
|
|
|
Compare MC10EL58D with alternatives
Compare SY10EL58ZITR with alternatives