MC10EL89DR2 vs SY10EL89ZI feature comparison

MC10EL89DR2 Freescale Semiconductor

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SY10EL89ZI Micrel Inc

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Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MOTOROLA SEMICONDUCTOR PRODUCTS MICREL INC
Package Description SOP, SOP8,.25 0.150 INCH, SOIC-8
Reach Compliance Code unknown not_compliant
JESD-30 Code R-PDSO-G8 R-PDSO-G8
JESD-609 Code e0 e0
Number of Terminals 8 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP8,.25 SOP8,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Power Supplies -5.2 V
Qualification Status Not Qualified Not Qualified
Supply Current-Max 28 mA
Surface Mount YES YES
Technology ECL10K ECL10K
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn85Pb15)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Base Number Matches 5 2
Part Package Code SOIC
Pin Count 8
ECCN Code EAR99
HTS Code 8542.39.00.01
Differential Output YES
Driver Number of Bits 1
High Level Input Current-Max 0.00015 A
Input Characteristics DIFFERENTIAL
Interface IC Type LINE DRIVER
Interface Standard GENERAL PURPOSE
Length 4.93 mm
Moisture Sensitivity Level 1
Number of Functions 1
Out Swing-Min 1.6 V
Peak Reflow Temperature (Cel) 240
Receive Delay-Max
Seated Height-Max 1.73 mm
Time@Peak Reflow Temperature-Max (s) 30
Transmit Delay-Max 0.44 ns
Width 3.94 mm

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