MC10EL89DTR2
vs
MC10EL89DTG
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
ON SEMICONDUCTOR
|
ROCHESTER ELECTRONICS LLC
|
Part Package Code |
SOIC
|
SOIC
|
Package Description |
PLASTIC, TSSOP-8
|
LEAD FREE, PLASTIC, TSSOP-8
|
Pin Count |
8
|
8
|
Reach Compliance Code |
not_compliant
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
|
Additional Feature |
NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V
|
NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V
|
Differential Output |
YES
|
YES
|
Driver Number of Bits |
2
|
2
|
Input Characteristics |
DIFFERENTIAL
|
DIFFERENTIAL
|
Interface IC Type |
LINE DRIVER
|
LINE DRIVER
|
Interface Standard |
GENERAL PURPOSE
|
GENERAL PURPOSE
|
JESD-30 Code |
S-PDSO-G8
|
S-PDSO-G8
|
JESD-609 Code |
e0
|
e3
|
Length |
3 mm
|
3 mm
|
Moisture Sensitivity Level |
1
|
NOT SPECIFIED
|
Number of Functions |
2
|
1
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
TSSOP
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
235
|
260
|
Qualification Status |
Not Qualified
|
COMMERCIAL
|
Seated Height-Max |
1.1 mm
|
1.1 mm
|
Supply Voltage-Max |
5.7 V
|
5.7 V
|
Supply Voltage-Min |
4.2 V
|
4.2 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
ECL
|
ECL
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
MATTE TIN
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Transmit Delay-Max |
0.44 ns
|
0.44 ns
|
Width |
3 mm
|
3 mm
|
Base Number Matches |
2
|
1
|
Pbfree Code |
|
No
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare MC10EL89DTR2 with alternatives
Compare MC10EL89DTG with alternatives