MC10EP31D
vs
MC10E151FNR2
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
| Package Description |
SOP, SOP8,.25
|
QCCJ, LDCC28,.5SQ
|
| Reach Compliance Code |
unknown
|
unknown
|
| JESD-30 Code |
R-PDSO-G8
|
S-PQCC-J28
|
| JESD-609 Code |
e0
|
e0
|
| Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
| Max Frequency@Nom-Sup |
2700000000 Hz
|
1100000000 Hz
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
28
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
QCCJ
|
| Package Equivalence Code |
SOP8,.25
|
LDCC28,.5SQ
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE
|
CHIP CARRIER
|
| Power Supplies |
-3.0/-5.5/3.3/5.0 V
|
-5.2 V
|
| Power Supply Current-Max (ICC) |
47 mA
|
78 mA
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
YES
|
YES
|
| Technology |
ECL10K
|
ECL10K
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
GULL WING
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Trigger Type |
MASTER-SLAVE
|
MASTER-SLAVE
|
| Base Number Matches |
4
|
5
|
| Packing Method |
|
TAPE AND REEL
|
|
|
|