MC10EP52MNR4G
vs
MC100EP29DT
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ONSEMI
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
DFN
|
TSSOP
|
| Package Description |
DFN-8
|
|
| Pin Count |
8
|
20
|
| Manufacturer Package Code |
506AA
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Additional Feature |
NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V
|
|
| Family |
10E
|
|
| JESD-30 Code |
S-XDSO-N8
|
|
| Length |
2 mm
|
|
| Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
| Max Frequency@Nom-Sup |
4000000000 Hz
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Bits |
1
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
8
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Output Polarity |
COMPLEMENTARY
|
|
| Package Body Material |
UNSPECIFIED
|
|
| Package Code |
HVSON
|
|
| Package Equivalence Code |
SOLCC8,.08,20
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
|
| Packing Method |
TR
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Power Supply Current-Max (ICC) |
47 mA
|
|
| Prop. Delay@Nom-Sup |
0.41 ns
|
|
| Propagation Delay (tpd) |
0.38 ns
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1 mm
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
|
| Supply Voltage-Min (Vsup) |
3 V
|
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
|
| Surface Mount |
YES
|
|
| Technology |
ECL
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
NICKEL GOLD PALLADIUM
|
|
| Terminal Form |
NO LEAD
|
|
| Terminal Pitch |
0.5 mm
|
|
| Terminal Position |
DUAL
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Trigger Type |
POSITIVE EDGE
|
|
| Width |
2 mm
|
|
| Base Number Matches |
1
|
2
|
|
|
|
Compare MC10EP52MNR4G with alternatives
Compare MC100EP29DT with alternatives