MC10H115P
vs
MC10H115M
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA INC
|
ONSEMI
|
| Part Package Code |
DIP
|
SOIC
|
| Package Description |
DIP,
|
SOEIAJ-16
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Input Characteristics |
DIFFERENTIAL
|
DIFFERENTIAL
|
| Interface IC Type |
LINE RECEIVER
|
LINE RECEIVER
|
| Interface Standard |
GENERAL PURPOSE
|
GENERAL PURPOSE
|
| JESD-30 Code |
R-PDIP-T16
|
R-PDSO-G16
|
| JESD-609 Code |
e0
|
e4
|
| Length |
19.175 mm
|
10.2 mm
|
| Number of Functions |
1
|
4
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
75 °C
|
75 °C
|
| Operating Temperature-Min |
|
|
| Output Characteristics |
OPEN-EMITTER
|
|
| Output Polarity |
TRUE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Equivalence Code |
DIP16,.3
|
SOP16,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Receive Delay-Max |
1.45 ns
|
1.3 ns
|
| Receiver Number of Bits |
4
|
4
|
| Seated Height-Max |
4.44 mm
|
2.05 mm
|
| Surface Mount |
NO
|
YES
|
| Technology |
ECL
|
ECL
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
COMMERCIAL EXTENDED
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
5.275 mm
|
| Base Number Matches |
1
|
7
|
| Rohs Code |
|
Yes
|
| Factory Lead Time |
|
4 Weeks
|
| Samacsys Manufacturer |
|
onsemi
|
| Differential Output |
|
NO
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Supply Current-Max |
|
29 mA
|
|
|
|
Compare MC10H115P with alternatives
Compare MC10H115M with alternatives