MC10H116DR2G
vs
MC10H116FN
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ONSEMI
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
| Part Package Code |
SOIC
|
|
| Package Description |
SO-16
|
QCCJ, LDCC20,.4SQ
|
| Pin Count |
16
|
|
| Manufacturer Package Code |
751B-05
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Factory Lead Time |
4 Weeks
|
|
| Samacsys Manufacturer |
onsemi
|
|
| Differential Output |
YES
|
|
| Input Characteristics |
DIFFERENTIAL
|
|
| Interface IC Type |
LINE RECEIVER
|
|
| Interface Standard |
GENERAL PURPOSE
|
|
| JESD-30 Code |
R-PDSO-G16
|
S-PQCC-J20
|
| JESD-609 Code |
e3
|
e0
|
| Length |
9.9 mm
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
3
|
|
| Number of Terminals |
16
|
20
|
| Operating Temperature-Max |
75 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
QCCJ
|
| Package Equivalence Code |
SOP16,.25
|
LDCC20,.4SQ
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Receive Delay-Max |
1.3 ns
|
|
| Receiver Number of Bits |
3
|
|
| Seated Height-Max |
1.75 mm
|
|
| Supply Current-Max |
23 mA
|
23 mA
|
| Surface Mount |
YES
|
YES
|
| Technology |
ECL
|
ECL10K
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
COMMERCIAL
|
| Terminal Finish |
MATTE TIN
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
GULL WING
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
3.9 mm
|
|
| Base Number Matches |
1
|
5
|
| Negative Supply Voltage-Nom |
|
-5.2 V
|
| Power Supplies |
|
-5.2 V
|
|
|
|
Compare MC10H116DR2G with alternatives