MC10H116DR2G
vs
MC10H116FNR2G
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ONSEMI
|
ONSEMI
|
Part Package Code |
SOIC
|
QLCC
|
Package Description |
SO-16
|
LCC-20
|
Pin Count |
16
|
20
|
Manufacturer Package Code |
751B-05
|
775-02
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
onsemi
|
onsemi
|
Differential Output |
YES
|
YES
|
Input Characteristics |
DIFFERENTIAL
|
DIFFERENTIAL
|
Interface IC Type |
LINE RECEIVER
|
LINE RECEIVER
|
Interface Standard |
GENERAL PURPOSE
|
GENERAL PURPOSE
|
JESD-30 Code |
R-PDSO-G16
|
S-PQCC-J20
|
JESD-609 Code |
e3
|
e3
|
Length |
9.9 mm
|
8.965 mm
|
Moisture Sensitivity Level |
1
|
3
|
Number of Functions |
3
|
3
|
Number of Terminals |
16
|
20
|
Operating Temperature-Max |
75 °C
|
75 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
QCCJ
|
Package Equivalence Code |
SOP16,.25
|
LDCC20,.4SQ
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
SMALL OUTLINE
|
CHIP CARRIER
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Receive Delay-Max |
1.3 ns
|
1.3 ns
|
Receiver Number of Bits |
3
|
3
|
Seated Height-Max |
1.75 mm
|
4.57 mm
|
Supply Current-Max |
23 mA
|
23 mA
|
Surface Mount |
YES
|
YES
|
Technology |
ECL
|
ECL
|
Temperature Grade |
COMMERCIAL EXTENDED
|
COMMERCIAL EXTENDED
|
Terminal Finish |
MATTE TIN
|
MATTE TIN
|
Terminal Form |
GULL WING
|
J BEND
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
3.9 mm
|
8.965 mm
|
Base Number Matches |
1
|
1
|
Factory Lead Time |
|
4 Weeks
|
|
|
|
Compare MC10H116DR2G with alternatives
Compare MC10H116FNR2G with alternatives