MC10H116P
vs
MC10H116P
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA INC
|
ONSEMI
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
DIP, DIP16,.3
|
DIP-16
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Differential Output |
YES
|
YES
|
| High Level Input Current-Max |
0.000095 A
|
0.000095 A
|
| Input Characteristics |
DIFFERENTIAL
|
DIFFERENTIAL
|
| Interface IC Type |
LINE RECEIVER
|
LINE RECEIVER
|
| Interface Standard |
GENERAL PURPOSE
|
GENERAL PURPOSE
|
| JESD-30 Code |
R-PDIP-T16
|
R-PDIP-T16
|
| JESD-609 Code |
e0
|
e0
|
| Length |
19.175 mm
|
19.175 mm
|
| Number of Functions |
3
|
3
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
75 °C
|
75 °C
|
| Operating Temperature-Min |
|
|
| Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP16,.3
|
DIP16,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Receive Delay-Max |
1.45 ns
|
1.45 ns
|
| Receiver Number of Bits |
3
|
3
|
| Seated Height-Max |
4.44 mm
|
4.44 mm
|
| Supply Current-Max |
23 mA
|
23 mA
|
| Surface Mount |
NO
|
NO
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
COMMERCIAL EXTENDED
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn80Pb20)
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
7.62 mm
|
| Base Number Matches |
1
|
2
|
| Rohs Code |
|
No
|
| Samacsys Manufacturer |
|
onsemi
|
| Peak Reflow Temperature (Cel) |
|
235
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare MC10H116P with alternatives
Compare MC10H116P with alternatives