MC10H175M
vs
MC10H186L
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
ON SEMICONDUCTOR
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
SOIC
|
DIP
|
| Package Description |
EIAJ, SOP-16
|
CERAMIC, DIP-16
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
|
| Family |
10H
|
10H
|
| JESD-30 Code |
R-PDSO-G16
|
R-GDIP-T16
|
| JESD-609 Code |
e4
|
e0
|
| Length |
10.2 mm
|
19.49 mm
|
| Logic IC Type |
D LATCH
|
D FLIP-FLOP
|
| Moisture Sensitivity Level |
3
|
NOT SPECIFIED
|
| Number of Bits |
5
|
6
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
75 °C
|
75 °C
|
| Operating Temperature-Min |
|
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
SOP
|
DIP
|
| Package Equivalence Code |
SOP16,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
IN-LINE
|
| Packing Method |
RAIL
|
|
| Peak Reflow Temperature (Cel) |
260
|
235
|
| Power Supply Current-Max (ICC) |
107 mA
|
|
| Prop. Delay@Nom-Sup |
2.4 ns
|
|
| Propagation Delay (tpd) |
2 ns
|
3 ns
|
| Qualification Status |
Not Qualified
|
COMMERCIAL
|
| Seated Height-Max |
2.05 mm
|
5.08 mm
|
| Surface Mount |
YES
|
NO
|
| Technology |
ECL
|
ECL
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
COMMERCIAL EXTENDED
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Trigger Type |
LOW LEVEL
|
POSITIVE EDGE
|
| Width |
5.275 mm
|
7.62 mm
|
| Base Number Matches |
1
|
5
|
| Pbfree Code |
|
No
|
| Additional Feature |
|
RESET ACTIVE ONLY WHEN CLOCK IS LOW
|
| Output Characteristics |
|
OPEN-EMITTER
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
| fmax-Min |
|
250 MHz
|
|
|
|
Compare MC10H175M with alternatives