MC10H188FN
vs
MC10H188FNR2
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
ONSEMI
|
MOTOROLA INC
|
Part Package Code |
QLCC
|
QLCC
|
Package Description |
PLASTIC, LCC-20
|
QCCJ, LDCC20,.4SQ
|
Pin Count |
20
|
20
|
Reach Compliance Code |
not_compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
4 Weeks
|
|
Control Type |
ENABLE HIGH
|
ENABLE HIGH
|
Family |
10H
|
10H
|
JESD-30 Code |
S-PQCC-J20
|
S-PQCC-J20
|
JESD-609 Code |
e0
|
e0
|
Length |
8.965 mm
|
8.9662 mm
|
Logic IC Type |
BUFFER
|
BUFFER
|
Number of Bits |
6
|
6
|
Number of Functions |
6
|
6
|
Number of Inputs |
1
|
1
|
Number of Terminals |
20
|
20
|
Operating Temperature-Max |
75 °C
|
75 °C
|
Operating Temperature-Min |
|
|
Output Polarity |
INVERTED
|
INVERTED
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QCCJ
|
QCCJ
|
Package Equivalence Code |
LDCC20,.4SQ
|
LDCC20,.4SQ
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
Packing Method |
RAIL
|
TR
|
Peak Reflow Temperature (Cel) |
235
|
|
Power Supply Current-Max (ICC) |
46 mA
|
46 mA
|
Prop. Delay@Nom-Sup |
2.2 ns
|
2.2 ns
|
Propagation Delay (tpd) |
1.9 ns
|
1.9 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.57 mm
|
4.57 mm
|
Supply Voltage-Max (Vsup) |
-5.46 V
|
|
Supply Voltage-Min (Vsup) |
-4.94 V
|
|
Supply Voltage-Nom (Vsup) |
-5.2 V
|
|
Surface Mount |
YES
|
YES
|
Technology |
ECL
|
ECL
|
Temperature Grade |
COMMERCIAL EXTENDED
|
COMMERCIAL EXTENDED
|
Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
J BEND
|
J BEND
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
8.965 mm
|
8.9662 mm
|
Base Number Matches |
4
|
1
|
Additional Feature |
|
STROBED OUTPUTS
|
Output Characteristics |
|
OPEN-EMITTER
|
|
|
|
Compare MC10H188FN with alternatives
Compare MC10H188FNR2 with alternatives