MC10H188L
vs
MC10H188P
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ON SEMICONDUCTOR
|
ONSEMI
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
CERAMIC, DIP-16
|
PLASTIC, DIP-16
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
not_compliant
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Control Type |
ENABLE HIGH
|
ENABLE HIGH
|
| Family |
10H
|
10H
|
| JESD-30 Code |
R-GDIP-T16
|
R-PDIP-T16
|
| JESD-609 Code |
e0
|
e0
|
| Length |
19.49 mm
|
19.175 mm
|
| Logic IC Type |
BUFFER
|
BUFFER
|
| Number of Bits |
6
|
6
|
| Number of Functions |
6
|
6
|
| Number of Inputs |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
75 °C
|
75 °C
|
| Operating Temperature-Min |
|
|
| Output Polarity |
INVERTED
|
INVERTED
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP16,.3
|
DIP16,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Packing Method |
RAIL
|
RAIL
|
| Power Supply Current-Max (ICC) |
46 mA
|
46 mA
|
| Prop. Delay@Nom-Sup |
2.2 ns
|
2.2 ns
|
| Propagation Delay (tpd) |
1.9 ns
|
1.9 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
4.44 mm
|
| Supply Voltage-Max (Vsup) |
-5.46 V
|
-5.46 V
|
| Supply Voltage-Min (Vsup) |
-4.94 V
|
-4.94 V
|
| Supply Voltage-Nom (Vsup) |
-5.2 V
|
-5.2 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
ECL
|
ECL
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
COMMERCIAL EXTENDED
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
7.62 mm
|
| Base Number Matches |
1
|
2
|
| Factory Lead Time |
|
4 Weeks
|
| Peak Reflow Temperature (Cel) |
|
235
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|