MC10H641FNR2
vs
SY10H641JCTR
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
MICREL INC
|
| Package Description |
QCCJ, LDCC28,.5SQ
|
PLASTIC, LCC-28
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| JESD-30 Code |
S-PQCC-J28
|
S-PQCC-J28
|
| JESD-609 Code |
e0
|
e0
|
| Max I(ol) |
0.024 A
|
0.024 A
|
| Number of Terminals |
28
|
28
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
QCCJ
|
| Package Equivalence Code |
LDCC28,.5SQ
|
LDCC28,.5SQ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Power Supplies |
5 V
|
|
| Prop. Delay@Nom-Sup |
6.4 ns
|
6.3 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
ECL10K
|
ECL
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
J BEND
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Base Number Matches |
5
|
3
|
| Part Package Code |
|
QLCC
|
| Pin Count |
|
28
|
| HTS Code |
|
8542.39.00.01
|
| Additional Feature |
|
PECL-TTL CLOCK DISTRIBUTOR; STROBED OUTPUT; MAX PART TO PART SKEW = 1NS
|
| Family |
|
10H
|
| Input Conditioning |
|
DIFFERENTIAL LATCHED
|
| Load Capacitance (CL) |
|
50 pF
|
| Logic IC Type |
|
LOW SKEW CLOCK DRIVER
|
| Number of Functions |
|
1
|
| Number of Inverted Outputs |
|
|
| Number of True Outputs |
|
9
|
| Power Supply Current-Max (ICC) |
|
65 mA
|
| Same Edge Skew-Max (tskwd) |
|
0.5 ns
|
| Supply Voltage-Max (Vsup) |
|
5.25 V
|
| Supply Voltage-Min (Vsup) |
|
4.75 V
|
|
|
|
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