MC1121DMR2
vs
ICL7660ACBAZA
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
ONSEMI
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
SOIC
|
SOICN
|
| Package Description |
MICROPAK-8
|
SOP,
|
| Pin Count |
5
|
8
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
26 Weeks, 1 Day
|
| Analog IC - Other Type |
SWITCHED CAPACITOR CONVERTER
|
SWITCHED CAPACITOR CONVERTER
|
| Input Voltage-Max |
5.5 V
|
12 V
|
| Input Voltage-Min |
2.4 V
|
1.5 V
|
| Input Voltage-Nom |
5 V
|
5 V
|
| JESD-30 Code |
R-PDSO-G5
|
R-PDSO-G8
|
| JESD-609 Code |
e0
|
e3
|
| Length |
3 mm
|
4.9 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
5
|
8
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Output Current-Max |
0.06 A
|
|
| Output Voltage-Max |
-5.5 V
|
|
| Output Voltage-Min |
-2.4 V
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
SOP
|
| Package Equivalence Code |
TSSOP8,.19
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.1 mm
|
1.75 mm
|
| Surface Mount |
YES
|
YES
|
| Switcher Configuration |
DOUBLER INVERTER
|
DOUBLER
|
| Switching Frequency-Max |
200 kHz
|
10 kHz
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
Matte Tin (Sn) - annealed
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
3 mm
|
3.9 mm
|
| Base Number Matches |
2
|
3
|
| Pbfree Code |
|
Yes
|
| Manufacturer Package Code |
|
M8.15
|
| Samacsys Manufacturer |
|
Renesas Electronics
|
| Moisture Sensitivity Level |
|
1
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Technology |
|
CMOS
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
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