MC12009L
vs
MC12013D
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA INC
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP, DIP16,.3
|
SOP, SOP16,.25
|
| Pin Count |
16
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
|
| Additional Feature |
+5V TTL OPERATION ALSO; ON-CHIP ECL TO TTL TRANSLATOR
|
|
| Family |
ECL
|
|
| JESD-30 Code |
R-GDIP-T16
|
R-PDSO-G16
|
| JESD-609 Code |
e0
|
e0
|
| Length |
19.495 mm
|
|
| Logic IC Type |
PRESCALER
|
PRESCALER
|
| Number of Data/Clock Inputs |
1
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-30 °C
|
-40 °C
|
| Output Characteristics |
OPEN-EMITTER
|
|
| Output Polarity |
COMPLEMENTARY
|
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Equivalence Code |
DIP16,.3
|
SOP16,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Power Supply Current-Max (ICC) |
88 mA
|
|
| Propagation Delay (tpd) |
8.2 ns
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
|
| Surface Mount |
NO
|
YES
|
| Technology |
BIPOLAR
|
ECL
|
| Temperature Grade |
OTHER
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
|
| fmax-Min |
440 MHz
|
|
| Base Number Matches |
3
|
3
|
| Max Frequency@Nom-Sup |
|
550000000 Hz
|
| Power Supplies |
|
5/-5.2 V
|
|
|
|
Compare MC12009L with alternatives