MC12011P
vs
12509/BEAJC
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA INC
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
| Package Description |
DIP,
|
DIP, DIP16,.3
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
|
| Additional Feature |
+5V TTL OPERATION ALSO; ON-CHIP ECL TO TTL TRANSLATOR
|
|
| Family |
ECL
|
|
| JESD-30 Code |
R-PDIP-T16
|
R-XDIP-T16
|
| JESD-609 Code |
e0
|
e0
|
| Length |
19.175 mm
|
|
| Logic IC Type |
PRESCALER
|
PRESCALER
|
| Number of Data/Clock Inputs |
1
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-30 °C
|
-55 °C
|
| Output Characteristics |
OPEN-EMITTER
|
|
| Output Polarity |
COMPLEMENTARY
|
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC
|
| Package Code |
DIP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Power Supply Current-Max (ICC) |
88 mA
|
|
| Propagation Delay (tpd) |
8.2 ns
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.44 mm
|
|
| Surface Mount |
NO
|
NO
|
| Technology |
BIPOLAR
|
ECL
|
| Temperature Grade |
OTHER
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
|
| fmax-Min |
500 MHz
|
|
| Base Number Matches |
3
|
1
|
| Max Frequency@Nom-Sup |
|
420000000 Hz
|
| Package Equivalence Code |
|
DIP16,.3
|
| Power Supplies |
|
5,-5.2 V
|
| Screening Level |
|
38535Q/M;38534H;883B
|
|
|
|
Compare MC12011P with alternatives