MC13109FB
vs
TB31261AF
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
TOSHIBA CORP
|
| Package Description |
QFP, QFP52,.52SQ
|
QFP, QFP52,.52SQ
|
| Reach Compliance Code |
unknown
|
unknown
|
| JESD-30 Code |
S-PQFP-G52
|
S-PQFP-G52
|
| JESD-609 Code |
e0
|
|
| Number of Terminals |
52
|
52
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
-20 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QFP
|
QFP
|
| Package Equivalence Code |
QFP52,.52SQ
|
QFP52,.52SQ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK
|
FLATPACK
|
| Power Supplies |
2/5.5 V
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Current-Max |
12 mA
|
0.0333 mA
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.635 mm
|
0.65 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Base Number Matches |
3
|
1
|
| Pbfree Code |
|
No
|
| Part Package Code |
|
QFP
|
| Pin Count |
|
52
|
| HTS Code |
|
8542.39.00.01
|
| Length |
|
10 mm
|
| Number of Functions |
|
1
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Seated Height-Max |
|
2.45 mm
|
| Supply Voltage-Nom |
|
3.6 V
|
| Technology |
|
BICMOS
|
| Telecom IC Type |
|
CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
| Width |
|
10 mm
|
|
|
|
Compare TB31261AF with alternatives