MC14011BCP vs MC14011BD feature comparison

MC14011BCP Motorola Mobility LLC

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MC14011BD Rochester Electronics LLC

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Rohs Code No No
Part Life Cycle Code Transferred Active
Ihs Manufacturer MOTOROLA INC ROCHESTER ELECTRONICS LLC
Part Package Code DIP SOIC
Package Description DIP, SOP,
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-PDIP-T14 R-PDSO-G14
JESD-609 Code e0 e0
Length 18.86 mm 8.65 mm
Load Capacitance (CL) 50 pF
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Propagation Delay (tpd) 250 ns 250 ns
Qualification Status Not Qualified COMMERCIAL
Seated Height-Max 4.69 mm 1.75 mm
Supply Voltage-Max (Vsup) 18 V 18 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.62 mm 3.9 mm
Base Number Matches 3 4
Pbfree Code No
Peak Reflow Temperature (Cel) 240
Time@Peak Reflow Temperature-Max (s) 30

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