MC14011BCP vs MC14011UBCP feature comparison

MC14011BCP Motorola Semiconductor Products

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MC14011UBCP Rochester Electronics LLC

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Rohs Code No
Part Life Cycle Code Transferred Contact Manufacturer
Ihs Manufacturer MOTOROLA INC ROCHESTER ELECTRONICS LLC
Package Description PLASTIC, DIP-14 DIP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-PDIP-T14 R-PDIP-T14
JESD-609 Code e0 e4
Length 18.86 mm 18.86 mm
Load Capacitance (CL) 50 pF
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 250 ns 180 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.69 mm 4.69 mm
Supply Voltage-Max (Vsup) 18 V 18 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD NICKEL PALLADIUM GOLD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 5 5
Pbfree Code Yes
Part Package Code DIP
Pin Count 14
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40

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