MC14011BF vs MC14011BCP feature comparison

MC14011BF Rochester Electronics LLC

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MC14011BCP Motorola Mobility LLC

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Active Transferred
Ihs Manufacturer ROCHESTER ELECTRONICS LLC MOTOROLA INC
Part Package Code SOIC DIP
Package Description EIAJ, SO-14 DIP,
Pin Count 14 14
Reach Compliance Code unknown unknown
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-PDSO-G14 R-PDIP-T14
JESD-609 Code e4 e0
Length 10.2 mm 18.86 mm
Logic IC Type NAND GATE NAND GATE
Moisture Sensitivity Level NOT SPECIFIED
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 250 ns 250 ns
Qualification Status COMMERCIAL Not Qualified
Seated Height-Max 2.05 mm 4.69 mm
Supply Voltage-Max (Vsup) 18 V 18 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish NICKEL PALLADIUM GOLD TIN LEAD
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40
Width 5.275 mm 7.62 mm
Base Number Matches 2 3
HTS Code 8542.39.00.01
Load Capacitance (CL) 50 pF

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