MC14023BAL vs HCF4093BEY feature comparison

MC14023BAL Motorola Semiconductor Products

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HCF4093BEY STMicroelectronics

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC STMICROELECTRONICS
Package Description DIP, ROHS COMPLIANT, PLASTIC, DIP-14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-GDIP-T14 R-PDIP-T14
JESD-609 Code e0 e4
Length 19.495 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Number of Functions 3 4
Number of Inputs 3 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 300 ns 380 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 5.1 mm
Supply Voltage-Max (Vsup) 18 V 20 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD NICKEL PALLADIUM GOLD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 3 1
Part Package Code DIP
Pin Count 14
Samacsys Manufacturer STMicroelectronics
Package Equivalence Code DIP14,.3
Packing Method TUBE
Prop. Delay@Nom-Sup 380 ns
Schmitt Trigger YES

Compare MC14023BAL with alternatives

Compare HCF4093BEY with alternatives