MC14044BCLD vs MC14044BD feature comparison

MC14044BCLD Motorola Mobility LLC

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MC14044BD Motorola Mobility LLC

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Rohs Code No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MOTOROLA INC MOTOROLA INC
Part Package Code DIP SOIC
Package Description DIP, DIP16,.3 SOP, SOP16,.25
Pin Count 16 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-GDIP-T16 R-PDSO-G16
JESD-609 Code e0 e0
Length 19.3 mm 9.9 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type R-S LATCH R-S LATCH
Number of Bits 4 4
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP16,.3 SOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Propagation Delay (tpd) 350 ns 350 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.19 mm 1.75 mm
Supply Voltage-Max (Vsup) 18 V 18 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Trigger Type LOW LEVEL LOW LEVEL
Width 7.62 mm 3.9 mm
Base Number Matches 3 5
Max I(ol) 0.00088 A
Prop. Delay@Nom-Sup 350 ns

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