MC14044BDR2G vs HEF4044BF feature comparison

MC14044BDR2G onsemi

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HEF4044BF NXP Semiconductors

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Pbfree Code Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ONSEMI NXP SEMICONDUCTORS
Part Package Code SOIC 16 LEAD DIP
Pin Count 16 16
Manufacturer Package Code 751B-05
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 9 Weeks
Samacsys Manufacturer onsemi
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-PDSO-G16 R-GDIP-T16
JESD-609 Code e3
Length 9.9 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type R-S LATCH R-S LATCH
Moisture Sensitivity Level 1
Number of Bits 4 4
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code SOP DIP
Package Equivalence Code SOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 350 ns
Propagation Delay (tpd) 350 ns 185 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 5.08 mm
Supply Voltage-Max (Vsup) 18 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade MILITARY
Terminal Finish MATTE TIN
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Trigger Type LOW LEVEL LOW LEVEL
Width 3.9 mm 7.62 mm
Base Number Matches 1 1
Package Description DIP,

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