MC14099BAL vs MC14099BCPG feature comparison

MC14099BAL Motorola Mobility LLC

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MC14099BCPG onsemi

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC ONSEMI
Part Package Code DIP DIP
Package Description DIP, ROHS COMPLIANT, PLASTIC, DIP-16
Pin Count 16 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 1:8 DMUX FOLLOWED BY LATCH 1:8 DMUX FOLLOWED BY LATCH
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-GDIP-T16 R-PDIP-T16
JESD-609 Code e0 e3
Length 19.3 mm 19.175 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type D LATCH D LATCH
Number of Bits 1 1
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Polarity TRUE TRUE
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 400 ns 400 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.19 mm 4.44 mm
Supply Voltage-Max (Vsup) 18 V 18 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD Tin (Sn)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Trigger Type LOW LEVEL LOW LEVEL
Width 7.62 mm 7.62 mm
Base Number Matches 3 1
Pbfree Code Yes
Factory Lead Time 4 Weeks
Samacsys Manufacturer onsemi
Package Equivalence Code DIP16,.3
Packing Method RAIL
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 400 ns
Time@Peak Reflow Temperature-Max (s) 40

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