MC14099BAL vs MC14099BCP feature comparison

MC14099BAL Freescale Semiconductor

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MC14099BCP Motorola Semiconductor Products

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Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MOTOROLA SEMICONDUCTOR PRODUCTS MOTOROLA INC
Package Description DIP, DIP16,.3 PLASTIC, DIP-16
Reach Compliance Code unknown unknown
JESD-30 Code R-XDIP-T16 R-PDIP-T16
JESD-609 Code e0 e0
Logic IC Type D LATCH D LATCH
Number of Bits 8 1
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP16,.3 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Power Supplies 5/15 V
Qualification Status Not Qualified Not Qualified
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 3 4
HTS Code 8542.39.00.01
Additional Feature 1:8 DMUX FOLLOWED BY LATCH; RESET ACTIVE ONLY WHEN LATCH ENABLE IS HIGH
Family 4000/14000/40000
Length 19.175 mm
Load Capacitance (CL) 50 pF
Max I(ol) 0.004200000000000001 A
Output Polarity TRUE
Prop. Delay@Nom-Sup 400 ns
Propagation Delay (tpd) 400 ns
Seated Height-Max 4.44 mm
Supply Voltage-Max (Vsup) 18 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 5 V
Trigger Type LOW LEVEL
Width 7.62 mm