MC14099BALD vs MC14099BFL1 feature comparison

MC14099BALD Freescale Semiconductor

Buy Now Datasheet

MC14099BFL1 Rochester Electronics LLC

Buy Now Datasheet
Rohs Code No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer MOTOROLA SEMICONDUCTOR PRODUCTS ROCHESTER ELECTRONICS LLC
Package Description DIP, DIP16,.3 EIAJ, PLASTIC, SOIC-16
Reach Compliance Code unknown unknown
JESD-30 Code R-XDIP-T16 R-PDSO-G16
JESD-609 Code e0 e4
Logic IC Type D LATCH D LATCH
Number of Bits 8 1
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Power Supplies 5/15 V
Surface Mount NO YES
Technology CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish Tin/Lead (Sn/Pb) NICKEL PALLADIUM GOLD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Base Number Matches 3 2
Pbfree Code Yes
Part Package Code SOIC
Pin Count 16
Additional Feature 1:8 DMUX FOLLOWED BY LATCH; RESET ACTIVE ONLY WHEN LATCH ENABLE IS HIGH
Family 4000/14000/40000
Length 10.2 mm
Moisture Sensitivity Level NOT SPECIFIED
Output Polarity TRUE
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 400 ns
Qualification Status COMMERCIAL
Seated Height-Max 2.05 mm
Supply Voltage-Max (Vsup) 18 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 5 V
Time@Peak Reflow Temperature-Max (s) 40
Trigger Type LOW LEVEL
Width 5.275 mm