MC14099BDWR2
vs
MC14099BALDS
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
Package Description |
SOP, SOP16,.4
|
DIP, DIP16,.3
|
Reach Compliance Code |
unknown
|
unknown
|
JESD-30 Code |
R-PDSO-G16
|
R-XDIP-T16
|
JESD-609 Code |
e0
|
e0
|
Logic IC Type |
D LATCH
|
D LATCH
|
Number of Bits |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-55 °C
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC
|
Package Code |
SOP
|
DIP
|
Package Equivalence Code |
SOP16,.4
|
DIP16,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
IN-LINE
|
Packing Method |
TAPE AND REEL
|
|
Power Supplies |
5/15 V
|
5/15 V
|
Qualification Status |
Not Qualified
|
|
Surface Mount |
YES
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
MILITARY
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
GULL WING
|
THROUGH-HOLE
|
Terminal Pitch |
1.27 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
4
|
3
|
|
|
|