MC14099BDWR2G vs MC14099BCP feature comparison

MC14099BDWR2G onsemi

Buy Now Datasheet

MC14099BCP Motorola Mobility LLC

Buy Now Datasheet
Pbfree Code Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer ONSEMI MOTOROLA INC
Part Package Code SO-16 WB DIP
Package Description SOIC-16 DIP, DIP16,.3
Pin Count 16 16
Manufacturer Package Code 751G-03
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 2 Days
Samacsys Manufacturer onsemi
Additional Feature 1:8 DMUX FOLLOWED BY LATCH 1:8 DMUX FOLLOWED BY LATCH; RESET ACTIVE ONLY WHEN LATCH ENABLE IS HIGH
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-PDSO-G16 R-PDIP-T16
JESD-609 Code e3 e0
Length 10.3 mm 19.175 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type D LATCH D LATCH
Moisture Sensitivity Level 3
Number of Bits 1 1
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Equivalence Code SOP16,.4 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 400 ns 400 ns
Propagation Delay (tpd) 400 ns 400 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.65 mm 4.44 mm
Supply Voltage-Max (Vsup) 18 V 18 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish MATTE TIN Tin/Lead (Sn/Pb)
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Trigger Type LOW LEVEL LOW LEVEL
Width 7.5 mm 7.62 mm
Base Number Matches 1 3
Max I(ol) 0.004200000000000001 A

Compare MC14099BDWR2G with alternatives

Compare MC14099BCP with alternatives