MC141624FU
vs
KS5513C
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MOTOROLA INC
|
SAMSUNG SEMICONDUCTOR INC
|
Package Description |
LQFP,
|
SDIP, SDIP32,.4
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Consumer IC Type |
Y/C SEPARATOR IC
|
SYNC SEPARATOR IC
|
JESD-30 Code |
S-PQFP-G32
|
R-PDIP-T32
|
Length |
7 mm
|
29.4 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
32
|
32
|
Operating Temperature-Max |
75 °C
|
70 °C
|
Operating Temperature-Min |
-20 °C
|
-20 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LQFP
|
SDIP
|
Package Equivalence Code |
QFP32,.35SQ,32
|
SDIP32,.4
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
FLATPACK, LOW PROFILE
|
IN-LINE, SHRINK PITCH
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.6 mm
|
5.08 mm
|
Supply Voltage-Max (Vsup) |
5.25 V
|
5.25 V
|
Supply Voltage-Min (Vsup) |
4.75 V
|
4.75 V
|
Surface Mount |
YES
|
NO
|
Technology |
CMOS
|
BICMOS
|
Temperature Grade |
COMMERCIAL EXTENDED
|
COMMERCIAL
|
Terminal Form |
GULL WING
|
THROUGH-HOLE
|
Terminal Pitch |
0.8 mm
|
1.778 mm
|
Terminal Position |
QUAD
|
DUAL
|
Width |
7 mm
|
10.16 mm
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
No
|
Part Package Code |
|
DIP
|
Pin Count |
|
32
|
JESD-609 Code |
|
e0
|
Supply Current-Max |
|
25 mA
|
Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|