MC145026P
vs
KS9802
feature comparison
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
MOTOROLA INC
|
SAMSUNG SEMICONDUCTOR INC
|
Part Package Code |
DIP
|
DIP
|
Package Description |
DIP, DIP16,.3
|
DIP,
|
Pin Count |
16
|
16
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Consumer IC Type |
TRANSMITTER IC
|
TRANSMITTER IC
|
JESD-30 Code |
R-PDIP-T16
|
R-PDIP-T16
|
JESD-609 Code |
e0
|
|
Length |
19.175 mm
|
19.4 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP16,.3
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.44 mm
|
5.08 mm
|
Supply Voltage-Max (Vsup) |
18 V
|
5 V
|
Supply Voltage-Min (Vsup) |
2.5 V
|
2.2 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
7.62 mm
|
7.62 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare MC145026P with alternatives
Compare KS9802 with alternatives