MC14515BDWR2G vs CD4515BMJ feature comparison

MC14515BDWR2G onsemi

Buy Now Datasheet

CD4515BMJ National Semiconductor Corporation

Buy Now Datasheet
Pbfree Code Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ONSEMI NATIONAL SEMICONDUCTOR CORP
Part Package Code SOIC−24 WB
Package Description SOIC-24 DIP, DIP24,.6
Pin Count 24
Manufacturer Package Code 0.0751
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Samacsys Manufacturer onsemi
Additional Feature ADDRESS LATCHES
Family 4000/14000/40000 4000/14000/40000
Input Conditioning LATCHED LATCHED
JESD-30 Code R-PDSO-G24 R-GDIP-T24
JESD-609 Code e3 e0
Length 15.395 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type 4-LINE TO 16-LINE DECODER 4-LINE TO 16-LINE DECODER
Max I(ol) 0.00064 A
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 24 24
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code SOP DIP
Package Equivalence Code SOP24,.4 DIP24,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Packing Method RAIL
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 1100 ns 1100 ns
Propagation Delay (tpd) 1100 ns 1100 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.65 mm 4.572 mm
Supply Voltage-Max (Vsup) 18 V 15 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish MATTE TIN TIN LEAD
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 7.5 mm 15.24 mm
Base Number Matches 1 4
Rohs Code No

Compare MC14515BDWR2G with alternatives

Compare CD4515BMJ with alternatives