MC14541BCPD
vs
CD4541BCN
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
NATIONAL SEMICONDUCTOR CORP
|
Package Description |
DIP, DIP14,.3
|
PLASTIC, DIP-14
|
Reach Compliance Code |
unknown
|
compliant
|
JESD-30 Code |
R-PDIP-T14
|
R-PDIP-T14
|
JESD-609 Code |
e0
|
e0
|
Number of Terminals |
14
|
14
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP14,.3
|
DIP14,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Power Supplies |
5/15 V
|
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
MOS
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
3
|
4
|
Family |
|
4000/14000/40000
|
Length |
|
19.175 mm
|
Load/Preset Input |
|
YES
|
Logic IC Type |
|
BINARY COUNTER
|
Number of Functions |
|
1
|
Qualification Status |
|
Not Qualified
|
Seated Height-Max |
|
5.08 mm
|
Width |
|
7.62 mm
|
|
|
|