MC14555BCP vs HEF4555BP feature comparison

MC14555BCP Rochester Electronics LLC

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HEF4555BP NXP Semiconductors

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Part Life Cycle Code Contact Manufacturer Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC NXP SEMICONDUCTORS
Package Description DIP, PLASTIC, SOT-38-1, DIP-16
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000 4000/14000/40000
Input Conditioning STANDARD STANDARD
JESD-30 Code R-PDIP-T16 R-PDIP-T16
Length 19.175 mm 21.6 mm
Logic IC Type 2-LINE TO 4-LINE DECODER 2-LINE TO 4-LINE DECODER
Number of Functions 2 2
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 440 ns 280 ns
Seated Height-Max 4.44 mm 4.7 mm
Supply Voltage-Max (Vsup) 18 V 15 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 5 2
Pbfree Code Yes
Rohs Code Yes
Part Package Code DIP
Pin Count 16
JESD-609 Code e4
Load Capacitance (CL) 50 pF
Max I(ol) 0.00035999999999999997 A
Package Equivalence Code DIP16,.3
Prop. Delay@Nom-Sup 295 ns
Qualification Status Not Qualified
Terminal Finish NICKEL PALLADIUM GOLD

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