MC1455BP1 vs LM555CN/NOPB feature comparison

MC1455BP1 Motorola Semiconductor Products

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LM555CN/NOPB National Semiconductor Corporation

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Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MOTOROLA INC NATIONAL SEMICONDUCTOR CORP
Package Description DIP, DIP8,.3 PLASTIC, DIP-8
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Analog IC - Other Type PULSE PULSE; RECTANGULAR
JESD-30 Code R-PDIP-T8 R-PDIP-T8
JESD-609 Code e0 e3
Length 9.78 mm 9.817 mm
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP8,.3 DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.45 mm 5.08 mm
Supply Current-Max (Isup) 15 mA
Supply Voltage-Max (Vsup) 16 V 16 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) Matte Tin (Sn)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 5 2
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40

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