MC1455D
vs
SA555D
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
MOTOROLA INC
|
PHILIPS SEMICONDUCTORS
|
| Package Description |
PLASTIC, SO-8
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
PULSE
|
|
| JESD-30 Code |
R-PDSO-G8
|
|
| JESD-609 Code |
e0
|
e0
|
| Length |
4.9 mm
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
8
|
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
|
| Supply Current-Max (Isup) |
15 mA
|
|
| Supply Voltage-Max (Vsup) |
16 V
|
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
3.9 mm
|
|
| Base Number Matches |
4
|
6
|
| Package Equivalence Code |
|
SO(UNSPEC)
|
| Technology |
|
BIPOLAR
|
|
|
|