MC1488N
vs
DS14C88J
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
SAMSUNG SEMICONDUCTOR INC
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP-14
|
DIP, DIP14,.3
|
| Pin Count |
14
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Differential Output |
NO
|
NO
|
| Driver Number of Bits |
1
|
1
|
| High Level Input Current-Max |
0.00001 A
|
0.00001 A
|
| Input Characteristics |
GATED
|
GATED
|
| Interface IC Type |
LINE DRIVER
|
LINE DRIVER
|
| Interface Standard |
EIA-232-C
|
EIA-232-C; V.24
|
| JESD-30 Code |
R-PDIP-T14
|
R-GDIP-T14
|
| JESD-609 Code |
e0
|
e0
|
| Length |
19.4 mm
|
19.43 mm
|
| Number of Functions |
4
|
4
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Out Swing-Min |
12 V
|
6 V
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP14,.3
|
DIP14,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Receive Delay-Max |
|
|
| Seated Height-Max |
5.08 mm
|
5.08 mm
|
| Supply Voltage-Max |
9.09 V
|
12.6 V
|
| Supply Voltage-Min |
8.91 V
|
4.5 V
|
| Supply Voltage-Nom |
9 V
|
|
| Supply Voltage1-Max |
-9.09 V
|
|
| Supply Voltage1-Min |
-8.91 V
|
|
| Supply Voltage1-Nom |
-9 V
|
|
| Surface Mount |
NO
|
NO
|
| Technology |
TTL
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Transmit Delay-Max |
175 ns
|
6000 ns
|
| Width |
7.62 mm
|
7.62 mm
|
| Base Number Matches |
1
|
2
|
|
|
|
Compare MC1488N with alternatives
Compare DS14C88J with alternatives