MC1489AP
vs
SN55LBC173TDA2
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
DIP
|
|
| Package Description |
PLASTIC, DIP-14
|
DIE
|
| Pin Count |
14
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
RESPONSE CONTROL
|
|
| Input Characteristics |
STANDARD
|
DIFFERENTIAL
|
| Interface IC Type |
LINE RECEIVER
|
LINE RECEIVER
|
| Interface Standard |
EIA-232-C
|
EIA-422-A; EIA-423-A; EIA-485; CCITT V.11
|
| JESD-30 Code |
R-PDIP-T14
|
R-XUUC-N16
|
| JESD-609 Code |
e3
|
|
| Number of Functions |
4
|
4
|
| Number of Terminals |
14
|
16
|
| Operating Temperature-Max |
75 °C
|
|
| Operating Temperature-Min |
|
|
| Output Characteristics |
TOTEM-POLE
|
3-STATE
|
| Output Low Current-Max |
0.01 A
|
|
| Output Polarity |
INVERTED
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
DIP
|
DIE
|
| Package Equivalence Code |
DIP14,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
UNCASED CHIP
|
| Qualification Status |
Not Qualified
|
|
| Receive Delay-Max |
85 ns
|
|
| Receiver Number of Bits |
4
|
4
|
| Seated Height-Max |
5.1 mm
|
|
| Supply Current-Max |
26 mA
|
11 mA
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
BIPOLAR
|
BICMOS
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
UPPER
|
| Width |
7.62 mm
|
1.932 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Length |
|
2.04 mm
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare MC1489AP with alternatives
Compare SN55LBC173TDA2 with alternatives