MC14C88BD
vs
MC1488LDS
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ON SEMICONDUCTOR
|
MOTOROLA INC
|
| Part Package Code |
SOIC
|
DIP
|
| Package Description |
SOP, SOP14,.25
|
DIP,
|
| Pin Count |
14
|
14
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
1 SINGLE INPUT DRIVER
|
|
| Differential Output |
NO
|
NO
|
| Driver Number of Bits |
4
|
1
|
| High Level Input Current-Max |
0.00001 A
|
|
| Input Characteristics |
GATED
|
GATED
|
| Interface IC Type |
LINE DRIVER
|
LINE DRIVER
|
| Interface Standard |
EIA-232-D; V.28; EIA-562
|
EIA-232-C
|
| JESD-30 Code |
R-PDSO-G14
|
R-CDIP-T14
|
| JESD-609 Code |
e0
|
e0
|
| Length |
8.65 mm
|
|
| Number of Functions |
1
|
4
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Out Swing-Min |
7.4 V
|
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
SOP
|
DIP
|
| Package Equivalence Code |
SOP14,.25
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
235
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Receive Delay-Max |
|
|
| Seated Height-Max |
1.75 mm
|
|
| Supply Voltage-Max |
15 V
|
12 V
|
| Supply Voltage-Min |
4.5 V
|
9 V
|
| Supply Voltage-Nom |
12 V
|
|
| Surface Mount |
YES
|
NO
|
| Technology |
BIMOS
|
TTL
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Transmit Delay-Max |
3500 ns
|
350 ns
|
| Width |
3.9 mm
|
|
| Base Number Matches |
2
|
1
|
|
|
|
Compare MC14C88BD with alternatives
Compare MC1488LDS with alternatives